Canteliver Probe Card
MPI Cantilever Probe Card is commonly used on gold bump and pad wafer testing for Exhibit driver, logic, and memory device. MPI’s cantilever probes would be the corresponding respond to for the calls for of fine pitch, compact pad dimension, substantial pace, less cleaning, multi-DUT, large pin rely, and extremely-very low leakage specifications. With fantastic craftsmanship, ground breaking architecture and confirmed methodologies determined by mechanical and electrical simulation/measurement effects, earning MPI the best cantilever service provider globally.
FCB Probe Card
The FCB Probe Card is considered the most mature engineering of buckling beam probe card. It truly is aimed to accomplish the semiconductor ship manufacture time-to-industry (TTM) and cost of test (COT) demand. FCB is really a confirmed solution for a number of semiconductor production exams from early engineering pilot-operates to large quantity production (HVM). FCB is ready for unit requiring higher sign integrity probing (SI) and/or ability integrity probing (PI). Purposes include things like slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB guarantees the world’s most effective Over-all Expense-of-possession (COO) for several DUT programs.
EVS Probe Card
The EVS Probe Card is definitely an improvement above the standard buckling beam probe card. Essential attributes are higher recent carrying capacity (C.C.C.) and lessen balanced Call power (BCF), as well as Over-all MEMS-like traits. EVS can certainly meet the prerequisite of Sophisticated wafer probing. Exact alignment and superb planarity Regulate will be the critical elements contributing to steady contact resistance. With its capability and general performance, EVS Probe Card is a great option for advanced probe cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to demand from customers for ever finer pitch. It really is suitable for smaller Al pad, and is perfect for very small pitch application with peripheral and total array pattern. With exact alignment and superior planarity control, Osprey can achieve increased efficiency by multi-DUT design. The forming wire (FW) kind needle developed with MPI’s more info individual micro fabrication system not only delivers higher-top quality effectiveness and also will allow easy needle replacement and shortens sustaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is designed for the demand of low force probing. Additionally, it comes with a chance to fulfill significant C.C.C. and significant pin counts software. The MEMS approach assures very consistent needle characteristics, and the special composition design and style enables specific alignment and planarity Command.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/